Method of preventing tungsten plugs from corrosion
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United States of America Patent
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Mar 9, 2004
Grant Date -
Oct 30, 2003
app pub date -
Apr 26, 2002
filing date -
Apr 26, 2002
priority date (Note) -
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Abstract
Tungsten plugs are prevented from corrosion, during fabrication of semiconductor devices, where the tungsten plug is formed in a substrate and coupled with a wire formed on the substrate. The substrate is dipped into a non-ionic benign solvent which substantially discharges the charges accumulated on a surface of the wire, followed by a rinsing process to clean the surface of the wire and then spin-drying.
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