Method and system for in-line monitoring process performance using measurable equipment signals
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United States of America Patent
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Mar 9, 2004
Grant Date -
Feb 13, 2003
app pub date -
Jan 25, 2002
filing date -
Jul 18, 2001
priority date (Note) -
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Abstract
A method and system for in-line monitoring process performance during wafer fabrication. First signals generated by a fabrication tool are collected and filtered to exclude abnormal signals while a model wafer is processed. The filtered first signals are regulated and normalized to generate model wafer data. After the fabrication process is completed, the model wafer is measured to generate a measured value representing the process quality thereof. The model wafer data and the measured value of the model wafer are used to build a correlation model by a correlation unit. Second signals generated by the fabrication tool are collected when a run wafer is processed, and then filtered to exclude abnormal signals. The filtered second signals are regulated and normalized to generate run wafer data. A predicted value representing the process quality of the run wafer is generated by inputting the run wafer data into the correlation model.
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