Two stage cooling system employing thermoelectric modules
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United States of America Patent
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Mar 16, 2004
Grant Date -
Oct 9, 2003
app pub date -
Apr 4, 2002
filing date -
Apr 4, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A cooling system is provided for cooling a heat generating component of an electronic device. The cooling system includes at least two cooling subsystems for a staged reduction of the temperature of a cooling fluid exposed to heat generated by the heat generated component. A first stage cooling subsystem reduces the temperature of the cooling fluid to ambient temperature or above, while a second stage cooling subsystem reduces the temperature of the cooling fluid exiting the first stage cooling subsystem to below ambient temperature. The first stage cooling subsystem is passive while the second stage cooling subsystem is active and can include one or more thermoelectric modules.
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