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Abstract

The present invention is directed to heat exchangers for process tools and, in particular, to semiconductor process tools incorporating heat exchangers. In one embodiment, the present invention is directed to a semiconductor process tool heat exchange system. The system includes a heat exchange system and a semiconductor process tool comprising an inlet and an outlet defining a flow path. The heat exchange system includes a compressor fluidly connected to the outlet, a condenser fluidly connected to the compressor and to the inlet, an expander positioned between the condenser and the outlet, and a heat exchange fluid. Examples of process tools suitable for use in this system include cathodes, cold plates, thermal chucks, and the like. In another embodiment, the present invention is directed to a method of exchanging heat in a semiconductor process tool. The method includes supplying a condensed heat exchange fluid to the semiconductor process tool and expanding the condensed heat exchange fluid to an expanded heat exchange fluid within the semiconductor process tool. In another embodiment, the method includes supplying a compressed heat exchange fluid to the semiconductor process tool and condensing the compressed heat exchange fluid to a condensed heat exchange fluid within the semiconductor process tool. Thus, depending on the embodiment, the method is suitable for both cooling and heating a semiconductor process tool.

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First Claim