Method for producing metallized substrate materials

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United States of America Patent

PATENT NO 6706201
SERIAL NO

09673760

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Abstract

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For manufacturing substrate materials which are needed for the manufacture of electrical circuit carriers, methods are known in which metal layers are applied to a dielectric substrate by means of a glow discharge process and thereafter additional metal layers are applied by means of electroplating processes. These methods however are not suitable for the manufacture of substrate materials which are suitable for high frequency applications in the gigahertz range. The invention starts from the previously-mentioned methods and solves the described problem through the use of fluoropolymers and through coating of these materials by means of a glow discharge process with nickel, since by this means even very smooth surfaces of the substrate can be securely coated. The metallised materials can be coated with additional metal layers from electroless or electrolytic deposition baths.

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Patent Owner(s)

Patent OwnerAddress
ATOTECH DEUTSCHLAND GMBHBERLIN GERMANY BERLIN BERLIN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Heinz, Roland Northeim, DE 2 11
Klusmann, Eckart Troisdorf, DE 2 6
Meyer, Heinrich Berlin, DE 46 532
Schulz, Ralf Hohen Neuendorf, DE 35 352

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