Semiconductor processing article
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United States of America Patent
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Mar 16, 2004
Grant Date -
Jul 18, 2002
app pub date -
Feb 7, 2002
filing date -
Jun 28, 1999
priority date (Note) -
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Abstract
A semiconductor processing article is characterized by extended useful life. The article is used in a semiconductor furnace system, particularly in a low pressure chemical vapor deposition furnace for prolonged periods without requiring cleaning to remove build-up film. The semiconductor processing article is a quartz body characterized by a surface roughness having a first component with an average deviation from a first mean surface of about 2.5 to 50 microns, and a second component with an average deviation from a second mean surface of about 0.25 to 5 microns. The processing article is prepared for use in the furnace by mechanically blasting and chemically etching the surface of the article
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