Method for fabricating capacitor in semiconductor device

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United States of America Patent

PATENT NO 6706607
SERIAL NO

10316874

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to a method for fabricating a capacitor in a semiconductor device; and, more particularly, to a method for fabricating a capacitor capable of stably forming a nitride layer on a lower electrode and obtaining improvements on stable capacitance and leakage current characteristics. The inventive method for fabricating a capacitor includes the steps of: forming a lower electrode on a substrate; forming a nitride-based first dielectric thin layer on the lower electrode; forming a second dielectric thin layer by depositing an Al.sub.2 O.sub.3 layer on the nitride-based first dielectric thin layer; forming a third dielectric thin layer on the second dielectric thin layer; and forming an upper electrode on the third dielectric thin layer.

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Patent Owner(s)

  • HYNIX SEMICONDUCTOR INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Kyong-Min Ichon-shi, KR 38 410
Oh, Hoon-Jung Ichon-shi, KR 8 13
Park, Jong-Bum Ichon-shi, KR 30 106

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