Semiconductor device including metal strap electrically coupled between semiconductor die and metal leadframe
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United States of America Patent
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Mar 16, 2004
Issued Date -
N/A
app pub date -
Sep 26, 2002
filing date -
Dec 1, 1999
priority date (Note) -
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Abstract
A semiconductor device is disclosed that includes a semiconductor die, a metal leadframe, and a metal strap. A bottom surface of the semiconductor device is on and electrically coupled to a first portion of the leadframe. A first end portion of the metal strap is on and electrically coupled to a top surface of the semiconductor die. An opposite, second end portion of the metal strap is on and electrically coupled to a second portion of the leadframe within a recess of the second portion of the leadframe.
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