Efficient multiple power and ground distribution of SMT IC packages

United States of America Patent

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Mar 16, 2004
Grant Date
Jul 4, 2002
app pub date
Dec 29, 2000
filing date
Dec 29, 2000

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Abstract

An apparatus, comprising a substrate having a surface, comprising an array of electrical contacts, and a plurality of electrical planes, where the plurality of electrical planes are positioned within the electrical contact array.

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Patent Owner(s)

Patent Owner	Address
BEIJING XIAOMI MOBILE SOFTWARE CO LTD	NO 018 8TH FLOOR BUILDING 6 NO 33 YARD MIDDLE XIERQI ROAD HAIDIAN DISTRICT BEIJING 100085 BEIJING CITY BEIJING CITY 100085

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Olivier, Robert L	Forest Grove, OR	3	37
Pollock, Steven L	Hillsboro, OR	8	84

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Efficient multiple power and ground distribution of SMT IC packages

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United States of America Patent

09753303

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PATENT NO	6707145
APP PUB NO	20020084533A1
SERIAL NO	09753303
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
March 16, 2004	US,6707145,B2 US6707145B2	GRANTED PATENT AS SECOND PUBLICATION
July 04, 2002	US,20020084533,A1 US20020084533A1	FIRST PUBLISHED PATENT APPLICATION

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09753303

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