Method and apparatus for direct connection between two integrated circuits via a connector
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United States of America Patent
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Mar 16, 2004
Grant Date -
N/A
app pub date -
Apr 2, 2001
filing date -
Apr 2, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A first package for an integrated circuit has both a first set of electrical contacts and a first connector. A second package has a second set of electrical contacts and a second connector. The first and the second connector are mating connectors that are electrically and physically coupled. The first set of electrical contacts and the first connector are disposed on opposite surfaces of the first package and the second set of electrical contacts and the second connector are disposed on the same surface of the second package. The first and second set of electrical contacts couple to a printed circuit board directly or indirectly through a socket. The connectors allow higher speed signals to be routed over the first and second connectors, while power, ground and slower speed signals can be routed over the first set and second set of electrical contacts.
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