Angled flying lead wire bonding process
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 23, 2004
Issued Date -
N/A
app pub date -
Jan 14, 2003
filing date -
Oct 19, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully