Cooling of electronics by electrically conducting fluids
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United States of America Patent
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Mar 23, 2004
Grant Date -
N/A
app pub date -
Dec 6, 2002
filing date -
Dec 6, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A system to provide effective removal of heat from a high power density device. The system has a heat spreader and a heat sink structure. The heat spreader is divided into one or more chambers. Electromagnetic pumps are placed inside each chamber in a configuration that facilitates easy circulation of liquid metal inside the chamber. The liquid metal preferably is an alloy of gallium and indium that has high electrical conductivity and high thermal conductivity. The liquid metal carries heat from a localized area (over the high power density device) and distributes it over the entire spreader. This results in a uniform distribution of heat on the base of the heat sink structure and hence effective removal of heat by the heat sink structure.
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