Apparatus and method for development
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United States of America Patent
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Mar 23, 2004
Grant Date -
Apr 24, 2003
app pub date -
Oct 17, 2002
filing date -
Oct 19, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A solution-receiving plate having solution-passing holes for passing a developer solution therethrough toward the back side of the plate is provided. Respective surfaces of the solution-receiving plate and a substrate are at the same height, and the solution-receiving plate is placed on the front-end side of the substrate and separated slightly from the front end of the substrate. A supply nozzle is moved to apply a developer solution. Accordingly, when the developer solution extended continuously between the perimeter of the substrate and the supply nozzle is severed, the severed developer solution is prevented from returning to the developer solution already spread over the substrate and thus flow and waves are prevented from occurring in the developer solution spread on the surface of the substrate. A resist pattern with a highly uniform line width is thus produced.
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