Robot blade for semiconductor processing equipment
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United States of America Patent
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Mar 23, 2004
Issued Date -
N/A
app pub date -
Jun 3, 1999
filing date -
Feb 14, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention generally provides a robot blade which provides a plurality of semi-conductive or conductive contacts disposed at least partially on the surface of the blade to support a substrate above the blade. The contacts are preferably located inwardly from the edge of the blade and toward the center of the blade to provide a collection area on the blade to capture any particles which may form. The blade is preferably made of a semi-conductive material, such as alumina or other semi-conductive material, to provide an electrical flow path through the contact(s) to discharge any electrical charge which may build up on the substrate during processing.
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