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Abstract

The present invention discloses an adhesive composition for flexible printed circuit board comprising the following component: (a) an epoxy resin; (b) an accelerator having a structure of one of the following general formulas: ##STR1## wherein, E represents sulfur, nitrogen or phosphorus; Ar represents an aromatic ring; R.sup.1 is the same or different and represents a substituted or unsubatituted monovalent hydrocarbon group, a hydroxyl group, an alkoxy group, a nitro group, a cyano group or a halogen atom; R.sup.2 and R.sup.3 each represents a hydrogen atom and a methyl group; R.sup.4 is the same or different and represents a substituted or unsubstituted monovalent hydrocarbon group; R.sup.5 represents a substituted or unsubstituted pyridinium group; a represents an integer of 0 to 2; and b represents 2 to 3; (c) a nitrile rubber having carboxyl groups, and a carboxyl terminated butadiene acrylonitrile is preferred; and (d) an inorganic filler, an aluminum hydroxide is preferred.

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First Claim