Interconnections for a semiconductor device and method for forming same
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United States of America Patent
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Mar 23, 2004
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N/A
app pub date -
Dec 11, 2001
filing date -
May 11, 1998
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Abstract
A method for forming an electrical contact for a semiconductor device comprises the steps of providing a semiconductor wafer section having a major surface with a plurality of conductive pads thereon and electrically coupling each pad with an elongated electrical interconnect. Next, each electrical interconnect is encased in a dielectric and the dielectric is sectioned to expose a portion of each interconnect. An inventive structure which can be formed by the inventive method is also described.
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