Methods of making microelectronic assemblies having conductive elastomeric posts
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 23, 2004
Grant Date -
Jun 27, 2002
app pub date -
Feb 20, 2002
filing date -
Dec 12, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of manufacturing a microelectronic assembly includes providing a first microelectronic element having a first surface and a plurality of terminals exposed at the first surface, providing a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface, forming a plurality of conductive elastomeric posts which connect each of the contacts to one of the terminals, and injecting a compliant material between the first surface of the first microelectronic element and the top surface of the second microelectronic element to form a compliant layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully