Apparatus and method of manufacturing a stackable package for a semiconductor device
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United States of America Patent
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Mar 23, 2004
Grant Date -
N/A
app pub date -
Aug 2, 2002
filing date -
Aug 2, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A package, a method of making and a method of assembly of packages for semiconductor chips are disclosed. The package includes a die attach pad on which a semiconductor die is mounted. A lead is electrically connected to the semiconductor die which is encapsulated in packaging material. The lead is exposed at opposed sides of the package. Exposing the lead on both sides of the package allows the package to be stacked or assembled so that the leads of adjacent pairs of packages are in electrical contact. Making the semiconductor packages includes forming a piece of electrically conductive material into a die attach pad and at least one lead associated with the die attach pad. A semiconductor die is mounted on the die attach pad and an electrical connection is made between the semiconductor die and the lead. The package is formed by encapsulation with the lead exposed on opposite sides of the package.
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