Printed circuit board having buried intersignal capacitance and method of making
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United States of America Patent
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-
Mar 23, 2004
Grant Date -
Oct 3, 2002
app pub date -
Mar 30, 2001
filing date -
Mar 30, 2001
priority date (Note) -
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Abstract
A first signal path is connected to a first plane via a plated hole. A first metal flood is connected to the plated hole to form a first plate. A second signal path is on a second plane. A second metal flood connected to the second signal path to form a second plate above the first plate.
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