Semiconductor device having a chip-size package
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United States of America Patent
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Mar 23, 2004
Grant Date -
Jun 12, 2003
app pub date -
Nov 21, 2002
filing date -
Dec 3, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device includes a semiconductor chip having an edge and having a surface with a plurality of electrodes. A film is mounted over the surface of the semiconductor chip, the film has first and second surfaces and has a device hole. The first surface of the film is oriented toward the surface of the semiconductor chip and so that the device hole exposes the electrodes of the semiconductor chip. Connecting conductors are disposed at the first surface of the film and extend into the device hole to the electrodes. Electrode pad holes are provided in the film, at positions between the device hole and the edge of the semiconductor chip to expose the conductors.
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