Importance

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Abstract

Flip chip packages and methods for producing a flip chip package by prepackaging one or more dice on a semiconductor wafer. The package, in one embodiment, includes an adhesive layer applied to an active side of the wafer. The adhesive layer has openings to permit access to the conductive pads on each die. A conductive material substantially fills the openings. Once diced from the wafer, the pre-packaged die is then surface mounted to a support wherein the conductive material effects electrical interconnection between the conductive pads on the die and receiving conductors on the support. In one embodiment, the package is heated to reflow the conductive material and bond the adhesive layer to the support. In another embodiment, the adhesive layer and conductive material are joined to the support by application of pressure. A protective layer is optionally formed on the back side of the wafer before dicing to complete the wafer package. To provide greater mounting densities, two or more dice may be coupled before application of the adhesive layer.

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First Claim