Wafer level packaging of micro electromechanical device
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United States of America Patent
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Mar 23, 2004
Grant Date -
Dec 11, 2003
app pub date -
Jun 6, 2002
filing date -
Jun 6, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present invention provides a wafer level package of micro electromechanical devices. The wafer level package of the present invention comprises a wafer having a plurality of micro electromechanical devices and a package wafer of the same size. A plurality of conductor plugs penetrate through the upper and lower surfaces of the package wafer. Solder bumps are formed on the conductor plugs to be adhered to predetermined solder bumps on the micro electromechanical device wafer so as to form a package device. The wafer level package of the present invention can prevent micro electromechanical devices from damage during the packaging procedure.
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