Method of pressure curing for reducing voids in a die attach bondline and applications thereof
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United States of America Patent
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Mar 23, 2004
Grant Date -
Mar 14, 2002
app pub date -
Jun 29, 2001
filing date -
Feb 29, 2000
priority date (Note) -
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Abstract
A method of curing adhesives of a die attach material to reduce the formation of voids at the resulting bondline, defined by the interface between the adhesive and the surface of a die being attached. The method includes applying a relatively high pressure, in addition to a relatively high temperature, to cure the adhesive material.
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