Three-dimensional memory cache system
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United States of America Patent
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Mar 23, 2004
Grant Date -
Nov 14, 2002
app pub date -
Jun 27, 2002
filing date -
Aug 14, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
The preferred embodiments described herein provide a three-dimensional memory cache system. In one preferred embodiment, a modular memory device removably connectable to a host device is provided. The modular memory device comprises a substrate, a cache memory array, a three-dimensional primary memory array, and a modular housing. The cache memory array and the three-dimensional primary memory array can be on the same or separate substrates in the modular housing. In another preferred embodiment, an integrated circuit is provided comprising a substrate, a cache memory array in the substrate, and a three-dimensional primary memory array above the substrate. Other preferred embodiments are provided, and each of the preferred embodiments can be used alone or in combination with one another.
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