Thermally enhanced interposer and method
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United States of America Patent
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Mar 30, 2004
Grant Date -
Jul 24, 2003
app pub date -
Jan 23, 2002
filing date -
Jan 23, 2002
priority date (Note) -
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Abstract
The present invention provides a heat spreading connector suitable for use with electronic components including those using land grid arrays and pin grid arrays and a method for its use. The connector of the present invention includes at least one dielectric layer and at least one thermally conductive layer.
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