Method for fabricating thin-film substrate and thin-film substrate fabricated by the method
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United States of America Patent
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Mar 30, 2004
Grant Date -
N/A
app pub date -
Sep 28, 2001
filing date -
Mar 30, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Supports (3) are formed to be arrayed on a support base (1), a sacrifice layer (15) is formed of a resin material, and the sacrifice layer (15) is planarized so as to expose the top of the respective supports (3), thereby forming a thin-film substrate (5) on top of the sacrifice layer (15) as planarized, and the supports (3). The sacrifice layer (15) is removed by plasma selective etching thereof through the intermediary of the thin-film substrate, and thereby a large-area thin-film substrate (5) floatingly spaced by a space (7) away from the support base (1) can be fabricated.
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