Lead frame for semiconductor package
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United States of America Patent
Stats
-
Mar 30, 2004
Grant Date -
Oct 3, 2002
app pub date -
Dec 10, 2001
filing date -
Mar 27, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor package including a lead frame comprising a frame including both a ground ring and a chip mounting board located therein. Extending between the ground ring and the chip mounting board are a plurality of elongate slots or apertures. The ground ring is formed to include recesses within the bottom surface thereof which create regions of reduced thickness. A semiconductor chip bonded to the chip mounting board may be electrically connected to leads of the lead frame and to the ground ring via conductive wires. Those conductive wires extending to the ground ring are bonded to the top surface thereof at locations which are not aligned with the recesses within the bottom surface, i.e., those regions of the ground ring of maximum thickness.
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