Method and device for laser drilling laminates
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United States of America Patent
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Mar 30, 2004
Issued Date -
N/A
app pub date -
Mar 29, 2002
filing date -
Sep 30, 1999
priority date (Note) -
Expired
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Abstract
A method and device for the laser drilling of laminates includes the use of a frequency-doubled Nd vanadate laser. The laser includes the following parameters: pulse width<40 ns, pulse frequency.gtoreq.30 kHz for the metal layer and .gtoreq.20 kHz for the dielectric layer, and wavelength=532 nmn. Such a laser is used for the laser drilling of laminates which have at least one metal layer and at least one dielectric layer including an organic material.
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