Low temperature co-fired ceramic-metal packaging technology
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United States of America Patent
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Mar 30, 2004
Grant Date -
Feb 20, 2003
app pub date -
Jul 19, 2002
filing date -
Dec 13, 1999
priority date (Note) -
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Abstract
Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.
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