CVD-PVD deposition process
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United States of America Patent
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Apr 6, 2004
Grant Date -
Dec 11, 2003
app pub date -
Jun 11, 2002
filing date -
Jun 11, 2002
priority date (Note) -
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Abstract
The present invention relates to a method for depositing metal layers on substrates with improved surface morphology. According to one aspect of the invention, a metal is deposited by chemical vapor deposition on a substrate having an aperture formed therein. A metal is then deposited on the substrate by physical vapor deposition performed with a low substrate temperature. The substrate is then heated. The substrate may then receive a metal deposited by physical vapor deposition performed at a high temperature and an additional heating step. The aperture of the resulting substrate is filled with metal and is substantially void-free and has a smooth surface morphology.
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