Process for producing semiconductor substrates
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United States of America Patent
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-
Apr 6, 2004
Grant Date -
Apr 3, 2003
app pub date -
Sep 19, 2002
filing date -
Sep 21, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process for producing semiconductor substrates with a coating film having excellent chemical resistance with high yield and excellent production reliability without any development of cracks and any generation or collection of foreign matter resulting from a projected portion of the coating film, which includes the steps of: (a) forming a coating film by coating an insulating film-forming coating liquid on a substrate mounted on a rotating disc of a spin coater according to a spin coating method; and (b) removing the projected portion of the coating film formed at a periphery of the substrate by ejecting a solvent through a nozzle moving from any point on a line drawn between the periphery edge and a center of the substrate toward the periphery edge while rotating the substrate.
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