Three-dimensional memory
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United States of America Patent
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Apr 6, 2004
Grant Date -
Apr 10, 2003
app pub date -
Aug 28, 2002
filing date -
Oct 7, 2001
priority date (Note) -
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Abstract
One greatest advantage of the three-dimensional memory (3D-M) is its integratibility. In a three-dimensional integrated memory (3DiM), the 3D-M is integrated with an embedded RWM and/or an embedded processor. Collectively, the 3DiM excels in speed, density/cost, programmability and data security. The present invention makes further improvements to three-dimensional mask-programmable read-only memory. Another 3D-M application of great importance is in the area of IC-testing. The 3D-M carrying test vectors can be integrated with the circuit-under-test, thus supporting field self-test and at-speed test.
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