Clip-type lead frame for source mounted die
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United States of America Patent
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-
Apr 6, 2004
Grant Date -
Jul 25, 2002
app pub date -
Jan 11, 2002
filing date -
Jan 22, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor package includes a lead frame having a displaced integral strap which is cupped out of a lead frame plane to provide a nest that receives a semiconductor chip electrically connected to an inner surface of the cupped strap. The semiconductor package further has a housing molded over and encapsulating the semiconductor chip with the frame such that a surface of the semiconductor chip facing away from the cupped strip is flush with or protrudes beyond a bottom of the housing.
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