Semiconductor module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 6, 2004
Grant Date -
May 1, 2003
app pub date -
Apr 30, 2002
filing date -
Oct 29, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A plurality of substrates are stacked on top of each other. A flexible cable serially connects the substrates. Semiconductor packages are mounted on the surfaces of the substrates. An adhesive material bonds adjoining semiconductor packages and holds the semiconductor packages in place with respect to each other. The bottommost substrate is provided with external leads by which the semiconductor module is mounted on the motherboard.
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