Blade-like connecting needle
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United States of America Patent
Stats
-
Apr 6, 2004
Grant Date -
Oct 17, 2002
app pub date -
Feb 12, 2002
filing date -
Apr 13, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A blade-like connecting needle for measuring a semiconductor wafer has an increased capability for measuring a small current and also has stable characteristics. The blade-like connecting needle includes a blade signal line for transmitting signal from the semiconductor wafer, a support insulator covering at least a portion of the blade signal line, a plurality of blade guard patterns disposed in or on the support insulator for electromagnetically shielding the blade signal line, and a probe supported on the support insulator and connected to the blade signal line. There are also disclosed processes of producing the blade-like connecting needle. A method for manufacturing a coaxial or hollow blade-like connecting needle is also provided.
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