Solderable flexible adhesive interposer as for an electronic package, and method for making same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 6, 2004
Grant Date -
N/A
app pub date -
May 25, 2000
filing date -
Jun 1, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A solderable flexible adhesive interposer having solderable contacts includes low-modulus-of-elasticity (i.e. molecularly flexible) conductive adhesive vias to which contacts of an electronic device, such as a semiconductor chip or die or other component, are connected. The flexible adhesive interposer substrate includes a sheet or layer of a molecularly flexible dielectric adhesive having via holes therein through which the flexible conductive adhesive vias reside. A thin layer of solderable metal, preferably a plating of gold or nickel-gold, on at least one exposed surface of the flexible conductive adhesive vias provides the solderable contacts connecting electrically to the conductive vias. The electronic device may be covered by a lid or by an encapsulant attached to the flexible adhesive interposer substrate and/or the electronic device.
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