Device and method for applying adhesive filaments to materials such as strands or flat substrates
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United States of America Patent
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Apr 13, 2004
Issued Date -
N/A
app pub date -
Sep 28, 2001
filing date -
Mar 14, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A device and method for applying adhesive to materials, such as elastic strands or flat substrates, used in the production of nonwoven products. Generally, a nozzle is provided and includes a liquid discharge orifice configured to discharge a bead of liquid adhesive. First and second pattern air discharge orifices are associated with the first liquid discharge orifice to vacillate or oscillate the adhesive bead. First and second cleaning and stabilizing air discharge orifices are also associated with the first liquid discharge orifice. These latter air discharge orifices keep airborne contaminants away from the associated liquid discharge orifice and also stabilize the oscillation of the adhesive bead in a single plane. Another embodiment includes walls to separate adjacent sets of air discharge orifices.
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