Test and burn-in connector
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United States of America Patent
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Apr 20, 2004
Issued Date -
N/A
app pub date -
Dec 2, 2002
filing date -
Mar 18, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An interconnection device is provided for temporary connection of a first electronic system to a second electronic system having a support substrate that includes an ordered array of conductive solder pads. A plurality of coil signal contacts are mounted to the conductive solder pads. Each one of the coil signal contacts comprises a central longitudinal axis, a top turn and a bottom turn that are arranged in spaced relation to one another. In this way, the bottom turn of one of the plurality of coil signal contacts is fastened to each of the conductive pads such that the top turns are spaced away from the support substrate.
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