Retention mechanism for an electrical assembly
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United States of America Patent
Stats
-
Apr 20, 2004
Grant Date -
May 22, 2003
app pub date -
Jan 2, 2003
filing date -
Aug 20, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A retention mechanism for an electronic assembly which has a substrate and a heat sink. The retention mechanism includes a substrate slot that receives the substrate and a heat sink slot that receives the heat sink. There may be two retention mechanisms that are attached to a printed circuit board adjacent to an electrical connector. There may be two heat sink slots symmetrically located about the substrate slot so that the mechanism can be mounted to a left side or a right side of the connector. The symmetric slots eliminate the need for a left side mechanism and a right side mechanism. The retainer mechanism may also have a nut retainer that captures a nut that is used to attach the mechanism to the printed circuit board. The nut retainer allows the nut to be transported with the retainer mechanism during an assembly process.
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