Method for quantifying uniformity patterns and including expert knowledge for tool development and control
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United States of America Patent
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Apr 20, 2004
Grant Date -
Apr 1, 2004
app pub date -
Dec 23, 2002
filing date -
Sep 26, 2002
priority date (Note) -
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Abstract
A system and method of for determining multiple uniformity metrics of a semiconductor wafer manufacturing process includes collecting a quantity across each one of a group of semiconductor wafers. The collected quantity data is scaled and a principal component analysis (PCA) is performed on the collected, scaled quantity data to produce a first set of metrics for the first group of semiconductor wafers. The first set of metrics including a first loads matrix and a first scores matrix.
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