Method of making a semiconductor package having exposed metal strap
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United States of America Patent
Stats
-
Apr 20, 2004
Grant Date -
Jun 19, 2003
app pub date -
Jan 31, 2003
filing date -
Dec 7, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Semiconductor devices and methods of forming such devices are disclosed. The devices include a package allowing for increased thermal dissipation. In one embodiment, the device includes a power MOSFET die that is electrically connected to a portion of the substrate with a metal strap. The die and at least portions of the strap and substrate are encapsulated in an insulative encapsulant, such as molded plastic. A top surface of the strap is exposed to the environment through the encapsulant. The exposed surface may have grooves formed therein, or fins formed thereon, to facilitate heat transfer.
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