Methods of making microelectronic assemblies including compliant interfaces
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United States of America Patent
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Apr 20, 2004
Issued Date -
N/A
app pub date -
Sep 26, 2002
filing date -
Sep 20, 1994
priority date (Note) -
Expired
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Abstract
A method of making a microelectronic assembly including a compliant interface includes providing a first support structure such as a flexible dielectric sheet having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support structure and bonding the stretched first support structure to a ring structure. A platen is provided in engagement with a second surface of the first support structure. The first surface of a second support structure, such as a semiconductor wafer, is abutted against the porous layer and, after the abutting step, a first curable liquid is disposed between the first and second support structures and within the porous layer. The first curable liquid may be at least partially cured.
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