High-reliability interposer for low cost and high reliability applications
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 20, 2004
Grant Date -
N/A
app pub date -
May 29, 2001
filing date -
Aug 24, 2000
priority date (Note) -
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Abstract
An interposer provides a high reliability interface between an LGA connector and a motherboard. The interposer includes a stepped spacer for each solder interconnection which prevents the relaxation of mechanical contact force while ensuring the integrity of each solder interconnection. The interposer provides noble metal plated contact pads on a first surface to receive the contact members of an LGA connector, and contact pads for BGA solder connections for attachment to a motherboard. A description of the processes to manufacture the interposer is also disclosed.
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