Package for a semiconductor chip
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United States of America Patent
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-
Apr 20, 2004
Grant Date -
N/A
app pub date -
Jun 26, 2003
filing date -
Nov 15, 1999
priority date (Note) -
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status (Latency Note)
Importance
Abstract
The invention relates to a packaging for a semiconductor chip. A frame that directly surrounds the slot is provide on the carrier board on the side of the nubbins. Said frame is provided with the same height as the nubbins and the slot and the frame surrounding said slot are at least partially filled with a casting compound which is preferably adapted to the thermal expansion coefficients of the semiconductor chip.
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