Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 20, 2004
Grant Date -
N/A
app pub date -
Feb 7, 2000
filing date -
Feb 8, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor chip having a functional bump provided on a surface of a semiconductor substrate thereof for electrical connection between an internal circuit thereof and a solid device, and a dummy bump not serving for the electrical connection between the internal circuit and the solid device. The dummy bump may be a stress relieving bump for relieving stresses exerted thereon. The dummy bump may be connected to a low impedance portion. The functional bump and the dummy bump may be provided on a surface protective film. In this case, the dummy bump is provided on a recess formed in the surface protective film.
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