Full wafer test configuration using memory metals
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United States of America Patent
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Apr 20, 2004
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N/A
app pub date -
Oct 30, 1997
filing date -
Oct 30, 1997
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Expired
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Abstract
A semi-conductor wafer test or burn-in apparatus having spring contacts made from a shape memory metal which plastically deforms under normal test loading and has a transition temperature at or above or at or below the burn-in temperature.
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