PROBE FOR COMBINED SIGNALS
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United States of America Patent
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Apr 20, 2004
Grant Date -
May 13, 2004
app pub date -
Nov 13, 2002
filing date -
Nov 13, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A direct current and a modulation signal are simultaneously applied to contact pads on a wafer to test certain devices, such as a laser diode. A probe, probing system, and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a signal path that avoids the impedance matching resistor.
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