US Patent No: 6,725,536

Number of patents in Portfolio can not be more than 2000

Methods for the fabrication of electrical connectors

Stats

ATTORNEY / AGENT: (SPONSORED)
 

Importance

Loading Importance Indicators... loading....

Abstract

Methods for the fabrication of an array of electrical connectors are provided. A conductive layer is formed into an array of generally-shaped electrical contacts which are interconnected with original structural material. The relative positioning of the contacts is reinforced. The original structural material is then removed, and the array is attached to a substrate.

Loading the Abstract Image... loading....

First Claim

Related Publications

Loading Related Publications... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID18599

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akram, Salman Boise, ID 829 21024
Farnworth, Warren M Nampa, ID 907 23394
Hembree, David R Boise, ID 401 9409

Cited Art

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (3)
6,049,977 Method of forming electrically conductive pillars 15 1997
6,319,333 Silicon-on-insulator islands 18 1998
6,397,460 Electrical connector 25 2000
 
AMP INCORPORATED (1)
5,173,055 Area array connector 186 1991
 
AMP-AKZO CORPORATION, A CORP. OF DE (1)
4,750,092 Interconnection package suitable for electronic devices and methods for producing same 73 1986
 
BERG TECHNOLOGY, INC. (1)
5,850,693 Method of manufacturing an array of surface mount contacts 15 1996
 
CEN TRONIC CO., LTD. (1)
5,386,626 Method for manufacturing a circuit board with a plurality of conductive terminal pins 12 1993
 
DELAWARE CAPITAL FORMATION, INC. (1)
6,084,421 Test socket 30 1998
 
FREESCALE SEMICONDUCTOR, INC. (1)
5,834,062 Material transfer apparatus and method of using the same 35 1997
 
GRUMMAN AEROSPACE CORPORATION (1)
5,067,233 Method of forming an integrated circuit module 16 1990
 
HARRIS CORPORATION (1)
4,772,864 Multilayer circuit prototyping board 28 1987
 
KABUSHIKI KAISHA TOSHIBA (1)
5,283,459 Semiconductor sensor including an aperture having a funnel shaped section intersecting a second section 49 1991
 
L-3 COMMUNICATIONS CORPORATION (1)
5,737,818 Method for forming electrical contact to the optical coating of an infrared detector 8 1996
 
MUTOH AMERICA, INC. (1)
4,616,406 Process of making a semiconductor device having parallel leads directly connected perpendicular to integrated circuit layers therein 59 1984
 
NIPPON STEEL SEMICONDUCTOR CORPORATION (1)
5,043,790 Sealed self aligned contacts using two nitrides process 36 1990
 
RESEARCH ORGANIZATION FOR CIRCUIT KNOWLEDGE (1)
6,092,282 Method of manufacturing printed circuits 9 1999
 
TEMIC TELEFUNKEN MICROELECTRONIC GMBH (1)
5,896,655 Method for manufacturing electrically conductive lead-throughs in metallized plastic housings 11 1997
 
THOR TECHNOLOGY CORPORATION (1)
4,871,317 Surface mounted component adaptor for interconnecting of surface mounted circuit components 31 1987
 
VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION (1)
5,741,741 Method for making planar metal interconnections and metal plugs on semiconductor substrates 45 1996
 
WELLS JAPAN LIMITED (1)
5,545,050 IC socket 39 1994

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (1)
7,183,194 Method of forming socket contacts 1 2004

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Oct 27, 2015
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00