Method for polishing leads for semiconductor packages

United States of America Patent

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Apr 27, 2004
Grant Date
Mar 21, 2002
app pub date
Nov 28, 2001
filing date
Sep 9, 1997

priority date (Note)
Expired

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Abstract

In a method for polishing leads of a semiconductor package, a plurality of semiconductor packages is arranged in a certain manner. Then, the leads are automatically polished. The semiconductor packages may be masked to expose at least a part of the leads to be polished.

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Patent Owner(s)

Patent Owner	Address
OKI SEMICONDUCTOR CO LTD	TOKYO

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Sato, Takeyuki	Tokyo, JP	9	3

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Method for polishing leads for semiconductor packages

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United States of America Patent

09994820

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PATENT NO	6726533
APP PUB NO	20020032940A1
SERIAL NO	09994820
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
April 27, 2004	US,6726533,B2 US6726533B2	GRANTED PATENT AS SECOND PUBLICATION
March 21, 2002	US,20020032940,A1 US20020032940A1	FIRST PUBLISHED PATENT APPLICATION

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