Semiconductor substrate having copper/diamond composite material and method of making same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6727117
SERIAL NO

10291126

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A semiconductor package for power transistors of the LDMOS type has a metallic substrate with a die mounted directly thereon, lead frame insulators mounted thereon adjacent the die and a plurality of leads mounted on the insulators and electrically coupled to the die by bond wires. The substrate includes a body having opposite surfaces comprising pure copper layers, and with the body interior being at least partially comprised of a copper/diamond composite so as to act as a heat spreader and provide improved heat removal and low thermal expansion, as well as an electrical connection for the die. The body may be entirely comprised of a copper/diamond composite, or it may be comprised of a copper/tungsten composite having a copper/diamond composite insert therein. The copper/diamond composite is comprised of diamond particles within a copper matrix. In a method of making the copper/diamond composite, diamond particles are coated with multiple layers of elements or inorganic compounds, mixed with a dry-processing binder and compacted in a die under pressure to form a compacted body. The body is placed on a quantity of copper, heated in a vacuum or hydrogen atmosphere to evaporate or decompose the binder, heated in a vacuum or hydrogen atmosphere to cause bonding or partial sintering of the coated diamond particles, then heated in a hydrogen atmosphere to a temperature slightly above the melting point of copper to melt and draw the copper into the bonded or partially sintered diamond particles. Following that, the compacted body is cooled and cut to the desired shape.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
KYOCERA AMERICA, INC.SAN DIEGO, CA11

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
McCoy, John Washington San Diego, CA 3 61

Cited Art Landscape

Patent Info (Count) # Cites Year
 
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NORTON COMPANY (1)
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SUMITOMO ELECTRIC INDUSTRIES, LTD. (6)
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5563101 Substrate for semiconductor apparatus 6 1995
5481136 Semiconductor element-mounting composite heat-sink base 22 1995
6171691 Heat sink material for use with semiconductor component and method for fabricating the same, and semiconductor package using the same 24 1998
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DWA COMPOSITE SPECIALITIES, INC. (1)
5120495 High thermal conductivity metal matrix composite 29 1991
 
POLESE, FRANK J. (2)
5886407 Heat-dissipating package for microcircuit devices 88 1996
6238454 Isotropic carbon/copper composites 30 1997
 
Amoco Corporation (2)
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NIPPON TUNGSTEN CO., LTD. (1)
5167697 Substrate material for mounting semiconductor device thereon and manufacturing method thereof 9 1991
 
GE AVIATION UK (1)
* 6284556 Diamond surfaces 20 1999
 
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6114048 Functionally graded metal substrates and process for making same 46 1998
 
E-Systems, Inc. (1)
5455738 High thermal conductivity, matched CTE. low density mounting plate for a semiconductor circuit 18 1993
 
LAWRENCE LIVERMORE NATIONAL SECURITY, LLC (1)
5783316 Composite material having high thermal conductivity and process for fabricating same 43 1996
 
Brush Wellman, Inc. (1)
5686676 Process for making improved copper/tungsten composites 17 1996
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
MATERION CORPORATION (2)
9117793 Air cavity packages having high thermal conductivity base plates and methods of making 0 2013
9035448 Semiconductor packages having metal composite base plates 0 2013
 
Third Millennium Materials, LLC (3)
* 8647534 Copper-carbon composition 0 2010
* 2013/0062,572 COPPER-CARBON COMPOSITION 3 2010
9273380 Aluminum-carbon compositions 0 2012
 
HVVI SEMICONDUCTORS, INC. (3)
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SAFE-T-CARE MANUFACTURING CO., INC. (1)
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A.L.M.T. CORP. (1)
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MATERIALS & ELECTROCHEMICAL RESEARCH CORP. (1)
* 2012/0063,071 Machinable metal/diamond metal matrix composite compound structure and method of making same 0 2011
 
SUMITOMO ELECTRIC INDUSTRIES, LTD. (1)
* 2004/0183,172 Package for housing semiconductor chip, and semiconductor device 12 2003
 
RENEWABLE THERMODYNAMICS, LLC (1)
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INFINEON TECHNOLOGIES AG (5)
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* 2010/0055,839 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE 2 2008
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* 2011/0084,369 DEVICE INCLUDING A SEMICONDUCTOR CHIP AND A CARRIER AND FABRICATION METHOD 2 2009
 
ADVANCED RESEARCH CORPORATION (1)
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PLANSEE SE (2)
* 6914330 Heat sink formed of diamond-containing composite material with a multilayer coating 3 2003
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M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC. (1)
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APPLE INC. (1)
* 7861768 Heat sink 6 2005
 
NANO MATERIALS INTERNATIONAL CORPORATION (8)
* 7279023 High thermal conductivity metal matrix composites 3 2003
* 2005/0074,355 High thermal conductivity metal matrix composites 2 2003
8066937 Method for making high thermal conductivity metal matrix composite 1 2007
* 7641709 High thermal conductivity metal matrix composites 0 2007
* 2008/0026,243 HIGH THERMAL CONDUCTIVITY METAL MATRIX COMPOSITES 3 2007
7988758 High thermal conductivity metal matrix composites 0 2010
* 2010/0110,637 HIGH THERMAL CONDUCTIVITY METAL MATRIX COMPOSITES 2 2010
8673453 High thermal conductivity metal matrix composites 0 2011
 
ESTIVATION PROPERTIES LLC (1)
7898057 Radio frequency power semiconductor device package comprising dielectric platform and shielding plate 4 2006
 
Lasertel, Inc. (3)
7660335 Liquid cooled laser bar arrays incorporating diamond/copper expansion matched materials 3 2008
* 2009/0262,767 LIQUID COOLED LASER BAR ARRAYS INCORPORATING DIAMOND/COPPER EXPANSION MATCHED MATERIALS 3 2008
7944955 Liquid cooled laser bar arrays incorporating diamond/copper expansion matched materials 0 2009
 
KYOCERA AMERICA, INC. (4)
* 7298046 Semiconductor package having non-ceramic based window frame 3 2003
* 2004/0195,662 Semiconductor package having non-ceramic based window frame 0 2003
7582964 Semiconductor package having non-ceramic based window frame 2 2007
* 2008/0142,963 Semiconductor Package Having Non-Ceramic Based Window Frame 1 2007
 
XENOGENIC DEVELOPMENT LIMITED LIABILITY COMPANY (9)
7335534 Semiconductor component and method of manufacture 5 2006
* 2006/0189,038 Semiconductor component and method of manufacture 0 2006
8530963 Power semiconductor device and method therefor 1 2006
7605451 RF power transistor having an encapsulated chip package 5 2006
8067834 Semiconductor component 4 2007
* 2009/0051,018 SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE 7 2007
7847369 Radio frequency power semiconductor device comprising matrix of cavities as dielectric isolation structure 5 2009
9029946 Power semiconductor device and method therefor 0 2013
9177866 Power semiconductor device and method therefor 0 2015
 
THIRD MILLENNIUM METALS, LLC (1)
* 2010/0327,233 Copper-Carbon Composition 6 2010
* Cited By Examiner